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Comparison of PIM™ Technology and other types of production process:
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 Other waterproofing production process on the market: |
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 XYZ CompanyˇXPIP ? technology |
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| Card Body (General) |
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| PIM? for Typical Package of SD Card Structure: |
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PACTEK PIM? Assembly Structure |
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| This diagram clear shows that within the same interior height of a SD card, PACTEKˇ¦s PIM technology can |
| easily achieve double capacity (allowing stacking of several layers of wafers) |
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| Hi-Volume: |
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| PIM™ technology compartments more than double capacity ( 2 Flash, even 4 Flash) |
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| Hi-Rigid: |
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PIM™ technology produces ore rigid product to keep your valuable data |
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PACTEK INDUSTRY CO.,LTD |
Address:NO.20,496LANE NOU PU SOUTH RD.,HSIH CHU,TAIWAN R.O.C.ˇ@
Tel:(03)530-1890ˇ@Fax:(03)530-4442
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